RELIFE RL-403 Solder Paste Flux Circuit Board Repair Syringe 10CC Sn63/Pb37

Description

RELIFE RL-403 Solder Paste Flux Circuit Board Repair Syringe 10CC Sn63/Pb37 20-38um no-clean Leaded Soldering Paste
Feature:
1.Good adhesion. Paste delicate, particles small, only 20~38 microns.
2.Excellent wettability.After opening, the surface remains moist for 36 hours. Does not affect the welding.
3.Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
Application:
Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive
Syringe 10CC RL-403 Solder Paste Flux 183℃ no-clean Phone Repair soldering
Specification:
Name: RELIFE RL-403 183℃ solder paste (syringe)
Specifications: 10cc
Alloy: Sn63/Pb37
Microns: 20-38um
Syringe 10CC RL-403 Solder Paste Flux 183℃ no-clean Phone Repair soldering
Specification:
Name: RELIFE RL-403 183℃ solder paste (syringe)
Specifications: 10cc
Alloy: Sn63/Pb37
Microns: 20-38um